Description
CHO-BOND 584-208 is a two-component, silver-filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.
Specifications
| Weight | N/A |
|---|---|
| Option | |
| Country Of Origin | United States |
| Commodity Code | 71159000 |
| Shelf Life | 270 |
| UN Number | 3082 CL9 |
Our new Service : Analyzes, designs, produces, installs and removes aircraft decals, stencils, signage, aesthetic and (permanent / temporary) protective coatings for all types of aircraft.
