Description
CHO-BOND 584-29 is a two-component, silver-filled, conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.
Specifications
| Weight | N/A |
|---|---|
| Option | 10gm Bipack, 1gm Bipack, 1Lb (454gm) Kit, 2.5gm Bipack, 3oz Kit |
| Country Of Origin | United States |
| Commodity Code | 71159000 |
| Shelf Life | 365 |
| UN Number | 3082 CL9 / 2735 CL8 |





