Description
CHO-BOND 4669 is a silver-plated, copper-filled, one-component conductive polyisobutylene designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.
Specifications
| Weight | N/A |
|---|---|
| Option | |
| Country Of Origin | United States |
| Commodity Code | 35061000 |
| Shelf Life | 180 |
| UN Number | 1993 CL3 |
Our new Service : Analyzes, designs, produces, installs and removes aircraft decals, stencils, signage, aesthetic and (permanent / temporary) protective coatings for all types of aircraft.
